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    AMD Technical Forum & Exposition 2007
     
    AMD Technical Forum & Exposition 2007

    AMD Technical Forum & Exposition 2007 is the world's third forum on thermo-mechanical packaging for multimedia and graphics hardware applications. This year we are proud to be adding Memory to our technical agenda.

    The AMD Technical Forum & Exposition will:
    • Focus on thermo-mechanical packaging, power & memory technologies that are playing a critical role in the development of current and future graphics/multimedia hardware applications.
    • Review industry-leading research and practice in delivering architectural innovations that extend the capabilities in video card technologies.
    • Gain essential knowledge to overcome challenges and achieve successful integration of multimedia applications in both desktop and mobile platforms.

    In addition to providing keynote speakers, AMD will be pleased to introduce our partners to top mechanical packaging, power & memory vendors who can add value to their new design initiatives. Furthermore, you can educate participants on your products’ advantages and generate leads to begin a meaningful sales process with highly qualified prospects. The most important of all, it will leave a lasting impress that will keep your company top of mind.

    AMD staff and AMD’s vendors, must submit their abstracts for the technical program before July 13th, 2007 and should submit their full presentation (in PowerPoint format) to the Technical Program Chair before August 3th, 2007. Other participants in the AMD TFE 2007 must contact the Exposition Chair, Gamal Refai-Ahmed before August 17th, 2007.

    General Chair:
    Gamal Refai-Ahmed, Ph.D., Fellow ASME
    AMD Fellow and Chief Thermal Architect,
    Graphics Product Group
    Gamal.refai-ahmed@amd.com
    Tel. (905)-882-2600, X6700


    Exposition Communication Chair:
    Ms. Melanie Gross
    Senior Project Program Co-coordinator
    melanie.gross@amd.com
    Tel#: (905) 709-6955 direct line

    Thermal Management Track Chair:
    Khalid Sheltami, Ph.D.
    Senior Member of Technical Staff,
    Graphic Products Group
    Khalid.sheltami@amd.com
    Tel. (905)-882-2600, X3977


    Power Technology Track Chair:
    Mr. Ming Chen, M.A.Sc.
    Manager, Graphics Board Development
    Ming.chen@amd.com
    Tel#: (905)882-2600, X8575

    Memory Technology Track Chair:
    Mr. Michael Litt
    Memory Technology Manager,
    Graphic Products Group
    Michael.litt@amd.com
    Tel. (905)-882-2600, X8142


     

    Main Info
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    Exhibitors:
    Adda
    Anpec
    ARX
    ASE
    AVC
    Auras
    CoolITsystems
    CT-E
    Foxconn
    Fujikura
    Future Electronics
    Hynix
    Indium
    Infineon
    King Cooler
    Laird
    Microloops
    Micropump
    Millennium
    National Semiconductor
    Nexsem
    NTK Technologies (HK) LTD.
    ONHorz3DR
    Qimonda
    Renesas Technology
    Richtek
    RNT
    Rohm
    R-Theta
    Samsung
    ST
    Taisol
    Texas Instuments
    Thermaltake
    UPI
    Vishay
    Volterra
         

     

     
     
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