ATI-TMPF 2005 is world’s first forum on thermo-mechanical
packaging for multimedia and graphics hardware applications.
The forum will be held on September 20th, 2005, at the Grand
Formosa Regent, Taipei, Taiwan.
- The ATI thermo-mechanical packaging forum will:
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- Focus on packaging technologies that are playing a critical
role in the development of current and future graphics/multimedia
hardware applications.
- Review industry-leading research and practice in delivering
architectural innovations that extend the capabilities in video
card technologies.
- Gain essential knowledge to overcome challenges and achieve
successful integration of multimedia applications in both
desktop and mobile
platforms.
In addition to providing keynote speakers, ATI will be pleased
to introduce our partners to top mechanical packaging vendors
who can add value to their new design initiatives. Furthermore,
you can educate participants on your products’ advantages
and generate leads to begin a meaningful sales process with highly
qualified prospects. The most important of all, it will leave
a lasting impress that will keep your company top of mind.
ATI staff and ATI’s vendors, who submitted their abstracts
for the technical program before August 31st, 2005, should submit
their full presentation (in PowerPoint format) to the Technical
Program Chair before Sep 5th, 2005. Other participants in the
TMPF 2005 Exposition must contact the Exposition Chair before
August 31st, 2005.
Technical Program Chair:
Gamal
Refai-Ahmed, Ph.D.,
Staff Thermal Engineer, ATI Technologies Inc.
Tel. (905)-882-2600, X6700 |
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Regional Contact:
Melody Tu (primary contact)
Marcom Marketing Manager,
ATI Technologies APAC
mtu@ati.com
Tel#: +886 (2) 2516 8333 x 8601,
+886 937 864 888
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Eva Chang (onsite logistic support)
Access PR
Eva_chang@accesspr.com.tw
Tel#: +886 (2) 8773 4277 x 133,
+886 961 014 135
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- 1st Session 8:00am - 10:00am
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- Challenges in Thermo-Mechanical Packaging in Future Generation
of Video Cards
- Chair: Robert Wily (ADDA)
- 2nd Session 10:15am - 12:00pm
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- Challenges in Thermo-Mechanical Packaging of Video Cards
in Desktop Applications
- Chairs: William Maltz (E-Cooling), and Tony Dunluck
(PSC)
- 3rd Session 1:30 pm - 3:30 pm
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- Challenges in Thermo-Mechanical Packaging of Video Cards
in Mobile Applications
- Chairs: Prof. Colin Novak (University of Windsor), and
Dr. Howard Sun (MEI)
- 4th Session 3:45pm - 5:00pm
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- Panel on Working Together Towards Optimum Thermo-Mechanical
Solutions
- Moderator: Dr. Gamal Refai-Ahmed (ATI)
- Dinner and Exposition 5:00 pm - 8:00pm
 Full session schedule
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