Memory Compatibility Testing:
The objective of the memory compatibility testing program is to ensure
compliance of different memory modules with the ATI Mobility Radeon™ 7000
IGP chipset. The modules are tested as to ATI specifications
using industry standard testing methods. This testing is
not intended to
replace the normal OEM module qualification process.
At this time, modules should be submitted to ATI for validation testing.
Please contact memory@ati.com should
you have any questions or wish to get your modules validated on an
ATI reference platform.
- Mobility Radeon™ 7000 IGP
| Buffalo |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 512 MB |
DN333-A512M |
2.5 |
16 |
32M X 16 |
Buffalo
ME46512823MEK |
| Elpida |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 256 MB |
EBD26UC6AKSA-6B |
2.5 |
8 |
16M X 16 |
Elpida
EDD2516AKTA-6B |
| 512 MB |
EBD52UD6ADSA-6B |
2.5 |
8 |
32M X 16 |
Elpida
EDD5116ADTA-6B |
| 1 GB |
EBD11UD8ABDA-6B |
2.5 |
16 |
64M X 8 |
Elpida
EDD5108ABNA-6B |
| 1 GB |
EBD11UD8ADDA-6B |
2.5 |
16 |
64M X 8 |
Elpida
EDD5108ADNA-6B |
| Hynix |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 128 MB |
HYMD216M646A6-J |
2.5 |
4 |
16M X 16 |
Hynix
HY5DU561622AT-J |
| 256 MB |
HYMD232M646A8-J |
2.5 |
8 |
32M X 8 |
Hynix
HY5DU56822AT-J |
| Micron |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 128 MB |
MT4VDDT1664HG-335C3 |
2.5 |
4 |
16M X 16 |
Micron
MT46V16M16-6T |
| 256 MB |
MT8VDDT3264HG-335C2 |
2.5 |
8 |
32M X 8 |
Micron
MT46V32M8-6T |
| 256 MB |
MT8VDDT3264HG-335C3 |
2.5 |
8 |
16M X 16 |
Micron
MT46V16M16-6T |
| 512 MB |
MT8VDDT6464HDG-335C1 |
2.5 |
8 |
32M X 16 |
Micron
MT46V32M16TG-6TC |
| 512 MB |
MT16VDDF6464HG-335C2 |
2.5 |
16 |
32M X 8 |
Micron
MT46V32M8FG-6 |
| Mosel Vitelic |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 256 MB |
V826632G24SATG-C0 |
2.5 |
8 |
32M X 8 |
Mosel Vitelic
V58C2256804SAT6 |
| 512 MB |
V826664G24SASG-C0 |
2.5 |
16 |
32M X 8 |
Mosel Vitelic
V58C2256804SAS6 |
| Nanya |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 256 MB |
NT256D64SH8BAGM-6K |
2.5 |
8 |
16Mx16 |
Nanya
NT5DS16M16BT-6K |
| 512 MB |
NT512D64S8HBAFM-6K |
2.5 |
16 |
32M X 8 |
Nanya
NT5DS32M8BF-6K |
| Qimonda (formerly Infineon) |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 128 MB |
HYS64D16000GDL-6-B |
2.5 |
4 |
16M x 16 |
Qimonda
HYB25D256160BT-6 |
| 128 MB |
HYS64D16000HDL-6-C |
2.5 |
4 |
16M x 16 |
Qimonda
HYB25D256160CE-6 |
| 256 MB |
HYS64D32020GDL-6-B |
2.5 |
8 |
16M x 16 |
Qimonda
HYB25D256160BT-6 |
| 256 MB |
HYS64D32020HDL-6-C |
2.5 |
8 |
16M x 16 |
Qimonda
HYB25D256160CE-6 |
| 512 MB |
HYS64D64020GBDL-6-B |
2.5 |
16 |
64M X 4 |
Qimonda
HYB25D256800BC-6 |
| Samsung |
| Density |
Module Part Number |
CL |
Loads |
Component Organization |
Component Vendor
& Part Number |
| 128 MB |
M470L1624DT0-CB3 |
2.5 |
4 |
16M X 16 |
Samsung
K4H561638D-TCB3 |
| 128 MB |
M470L1624FT0-CB3 |
2.5 |
8 |
16M X 16 |
Samsung
K4H561638F-TCB3 |
| 128 MB |
M470L1714DT0-CB3 |
2.5 |
8 |
8M X 16 |
Samsung
K4H281638D-TCB3 |
| 256 MB |
M470L3224DT0-CB3 |
2.5 |
8 |
16M X 16 |
Samsung
K4H561638D-TCB3 |
| 256 MB |
M470L3224FT0-CB3 |
2.5 |
8 |
16M X 16 |
Samsung
K4H561638F-TCB3 |
| 512 MB |
M470L6423DN0-CB3 |
2.5 |
16 |
32M X 8 |
Samsung
K4H560838D-NCB3 |
| 512 MB |
M470L6423EN0-CB3 |
2.5 |
16 |
32M X 8 |
Samsung
K4H560838E-NCB3 |
| 1 GB |
M470L2923BN0-CB3 |
2.5 |
16 |
64M X 8 |
Samsung
K4H510838B-TCB3 |
| 
